EB3250JA12-12.000M TR

EB3250 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Automotive Grade Quartz Crystal Resonator 3.2mm x 5.0mm x 0.85mm 4 Pad Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 7.6MHz to 54MHz Frequency Tolerance/Stability ±50ppm at 25°C, ±100ppm over -40°C to +85°C ±30ppm at 25°C, ±50ppm over -40°C to +85°C ±15ppm at 25°C, ±30ppm over -40°C to +85°C ±15ppm at 25°C, ±20ppm over -40°C to +85°C ±10ppm at 25°C, ±20ppm over -40°C to +85°C ±50ppm at 25°C, ±100ppm over -40°C to +105°C ±30ppm at 25°C, ±50ppm over -40°C to +105°C ±50ppm at 25°C, ±100ppm over -40°C to +125°C ±30ppm at 25°C, ±50ppm over -40°C to +125°C ±3ppm/year Maximum Aging at 25°C Load Capacitance Shunt Capacitance Equivalent Series Resistance Series Resonant, 8pF Parallel Resonant to 32pF Parallel Resonant 5pF Maximum Mode of Operation 100 Ohms Maximum over Nominal Frequency of 7.6MHz to 11.999999MHz 60 Ohms Maximum over Nominal Frequency of 12MHz to 13.999999MHz 50 Ohms Maximum over Nominal Frequency of 14MHz to 19.999999MHz 40 Ohms Maximum over Nominal Frequency of 20MHz to 54MHz AT-Cut Fundamental Drive Level 300µWatts Maximum Crystal Cut AT-Cut Spurious Response Measured from Fo to Fo +5000ppm -3dB Minimum -50°C to +150°C Storage Temperature Range Insulation Resistance Measured at 100Vdc 500 Megaohms Minimum Revised A: 5/18/2018 Page 2 of 10 www.ecliptek.com EB3250 Series PART NUMBERING GUIDE Revised A: 5/18/2018 Page 3 of 10 www.ecliptek.com EB3250 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN 1 CONNECTION Crystal 2 Cover/Ground 3 Crystal 4 Cover/Ground All Tolerances are ±0.1 All Dimensions in Millimeters Revised A: 5/18/2018 Page 4 of 10 www.ecliptek.com EB3250 Series TAPE & REEL DIMENSIONS Quantity per Reel: 1,000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised A: 5/18/2018 Page 5 of 10 www.ecliptek.com EB3250 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (ts MIN) Ramp-up Rate (TL to TP) 150°C 175°C 200°C 60 - 180 Seconds Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 217°C 60 - 150 Seconds Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 3°C/Second Maximum 260°C Maximum for 10 Seconds Maximum High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised A: 5/18/2018 Page 6 of 10 www.ecliptek.com EB3250 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) N/A 150°C N/A 30 - 60 Seconds Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) 150°C 200 Seconds Maximum Target Peak Temperature(TP Target) 245°C Maximum 2 Times/230˚C Maximum 1Time Time within 5°C of actual peak (tP) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 5°C/Second Maximum 245°C Maximum Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised A: 5/18/2018 Page 7 of 10 www.ecliptek.com